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CCLA Successfully Held the 2022 China Copper Clad Industry High Level Forum
On June 24, 2022, "2022 China Copper Clad Industry High Level Forum", hosted by China Electronics Materials Association (CCLA) and organized by Zhejiang Garden New Energy Co.
27
2022
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06
Economic Daily: The new materials industry is moving toward a qualitative leap
Materials are the cornerstone of human civilization, and the discovery, research and development and application promotion of new materials lead to social progress, technological revolution and industrial change. Since the 18th Party Congress, the new materials industry is moving from the accumulation of quantity to a qualitative leap, from the point of breakthrough to the improvement of system capabilities. A generation of new materials casting a generation of new equipment, a powerful generation of industry.
23
2022
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06
Recently, the Ministry of Industry and Information Technology announced the "Key New Materials First Batch Application Demonstration Guidance Catalog (2021 Edition)". The catalog contains ultra-thin electronic cloth and electronic-grade low dielectric glass fiber and products, namely item 114 106, 1037, 1067, 1027, 1017 ultra-thin and very thin electronic cloth, item 212 electronic-grade low dielectric glass fiber and products, etc.
07
2022
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01
Guangyuan New Material Attended the 22nd China Copper Clad Technology Seminar
On November 5, the "22nd China Copper Clad Technology Symposium" was successfully held in Zhuhai, Guangdong Province, hosted by the Copper Clad Materials Branch of the China Electronic Materials Association (CCLA) and the Copper Clad Branch of the China Electronic Circuits Association (CPCA).
05
2021
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11
On September 24, "2021 China Electronic Materials Industry Technology Development Conference" co-hosted by China Electronic Materials Industry Association and the Fifth Institute of Electronics of the Ministry of Industry and Information Technology was held in Guangzhou. The company participated in the conference as the executive director of China Electronic Materials Industry Association.
25
2021
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09
The company participated in the 2021 China Copper Clad High Level Forum
On July 23, 2021, "China Copper Clad Industry High Level Forum 2021", hosted by China Electronics Materials Association Copper Clad Materials Branch (CCLA) and organized by Nordic Investment Co., Ltd, was successfully held in Fuyin Changle International Hotel in Xining, Qinghai Province. 220 representatives from 122 units at home and abroad, including copper clad board and raw material manufacturing enterprises, equipment manufacturing enterprises, research institutes, social organizations and relevant associations, attended the meeting.
25
2021
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