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Guangyuan New Material Attended the 22nd China Copper Clad Technology Seminar



On November 5, the "22nd China Copper Clad Technology Symposium" was successfully held in Zhuhai, Guangdong Province, hosted by the Copper Clad Materials Branch of the China Electronic Materials Association (CCLA) and the Copper Clad Branch of the China Electronic Circuits Association (CPCA).

On Nov. 5, the "22nd China Copper Cladding Technology Symposium" hosted by China Electronics Materials Association (CCLA) and China Electronic Circuit Association (CPCA) Copper Cladding Branch was successfully held in Zhuhai, Guangdong Province. From domestic and foreign PCB, CCL and upstream raw materials, equipment manufacturing enterprises, related research institutes, universities and colleges, social organizations and other 133 units 221 representatives attended the meeting. The company as China Electronics Materials Industry Association copper clad materials branch vice chairman unit to participate in this meeting.

The theme of this year's seminar is "Upstream and downstream innovation together to achieve high-end technology leap". The conference is held in the context of 5G application and a new round of scientific and technological revolution and industrial change, and the laminate industry enters a new era of innovation and breakthrough in high-quality development. In the face of new opportunities and challenges, how can China's laminate industry promote technological innovation, accelerate high-end technology breakthroughs, achieve high-end technology leapfrogging and meet new market needs.

This seminar focuses on discussing the new progress of technological innovation breakthroughs, communicating the new trends of market demand, and showing the new achievements of copper cladding, raw materials and equipment, which is of great significance to promote the healthy development of the industry chain. The conference invited experts and technical personnel from China's copper clad industry and its upstream and downstream industries to conduct in-depth and extensive discussions and make wonderful speeches on new technologies, new processes, new materials, new equipment and future development trends of the copper clad market and technology in the manufacturing of copper clad panels.

In order to promote the innovative development of China's copper clad industry chain, the fourth council of the seventh session of China Electronics Materials Association (CCLA) decided to appoint famous experts in the copper clad industry chain, including Ning Xiangchun, general manager of Guangyuan New Material, to form the "Technical Committee of the Copper Clad Industry" and held the first meeting in the afternoon of November 4. Expert Symposium.

Since 2000, CCLA has established and held the "China Copper Clad Technical Seminar" every year, which has become the highest level technical exchange event in China's copper clad manufacturing industry and a platform to comprehensively display the new technical achievements of the global and China's copper clad industry chain. This year's seminar is rich in content, focusing on the new progress of technological innovation, the exchange of new trends in market demand, showing the new achievements of raw materials and equipment for copper clad board, which is of great significance to promote the healthy development of China's copper clad board industry chain.



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