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The company participated in the 2019 China Copper Clad Industry High Level Forum


Time:

2019-05-11

On May 10-11, 2019 China Copper Clad Industry High Level Forum was held in Mianyang, Sichuan Province, with more than 200 participants from the domestic copper clad industry, as well as upstream raw materials, downstream PCB industry, including representatives of famous experts, entrepreneurs, and representatives of industry service organizations.

On May 10-11, 2019 China Copper Clad Industry High Level Forum was held in Mianyang City, Sichuan Province, with more than 200 participants from the domestic copper clad industry, as well as upstream raw materials, downstream PCB industry, including famous expert representatives, entrepreneur representatives and representatives of industry service organizations. The company as the China Electronics Materials Industry Association copper clad materials branch vice chairman of the unit attended the meeting.

The theme of the conference is "adapt to the new situation, inject new momentum, pull new growth". Participants from the macro and industry perspectives on the laminate industry in 2019 and the future development trend of research and exchange, and from a different perspective a comprehensive analysis of the current domestic and international electronic materials market economic situation, summarize the current laminate market situation, the sustainable development of China's 5G communication industry to make guiding recommendations.

At the meeting, Zhang Dong, vice chairman of China Electronic Materials Industry Association and chairman of Copper Clad Materials Branch, delivered an opening speech; Lei Zhengming, deputy secretary-general of China Electronic Materials Industry Association and secretary-general of Copper Clad Materials Branch, made a report entitled "Survey and Analysis of the Operation of China's Copper Clad Industry in 2018"; Ning Xiangchun, general manager of the company, made a report entitled "New Development of Electronic Glass Fiber Cloth for China and Guangyuan's Copper Clad Board under New Market Demand", systematically interpreting the development trend of high-frequency and high-speed electronic materials and the progress of Guangyuan's new material low-dielectric electronic cloth project.

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