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The company participated in the 21st China Copper Clad Technology Seminar


Time:

2020-12-01

On November 29, the 21st China Copper Clad Laminate Technology Symposium was held in Sihui City, Guangdong Province. From domestic and foreign PCB, CCL and upstream raw materials, equipment manufacturing enterprises, related research institutes, universities and colleges, social organizations and other 146 units nearly 300 representatives attended the meeting

On November 29, the 21st China Copper Clad Laminate Technology Symposium was held in Sihui City, Guangdong Province. Nearly 300 representatives from 146 units attended the meeting, including domestic and foreign PCB, CCL and upstream raw materials, equipment manufacturing enterprises, relevant research institutes, universities and colleges, and social organizations. The company as China Electronics Materials Industry Association copper clad materials branch vice chairman unit attended the meeting.

This seminar is in the global economic situation is still complex and severe, copper clad industry development and market pattern uncertainty increased under the situation held a high-end technical forum and exchange event on copper clad, the theme of the meeting is " increase technological innovation to overcome difficulties to travel steadily to far ". The General Assembly invited experts from the copper clad board industry and its upstream and downstream industries at home and abroad, technical staff, new technologies, new processes, new materials, new equipment and future copper clad board manufacturing market, technology development trends, in-depth and extensive discussions.

Zhang Dong, Vice Chairman of China Electronics Materials Industry Association and Chairman of CCLA Branch, presided over the morning session and gave the opening speech for the conference; Dong Xiaojun, Senior Vice Chairman of China Electronic Circuits Industry Association and Chairman of CCLA Branch, and Li Weizhong, Deputy Secretary and Mayor of Sihui City, gave the welcome speech for the conference; 21 experts and scholars were invited to give wonderful reports; 39 papers were collected at the conference, and 10 excellent papers were selected by CCLA expert review panel and awarded the "2020 CCLA Cup Excellent Paper Award" at the conference.

This session of this symposium focuses on discussing new progress in technological innovation, communicating new trends in market demand, and showing new achievements in raw materials and equipment for copper-clad laminates, which is of great significance in promoting the healthy development of the industry chain.

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